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  tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 1 post office box 655303 ? dallas, texas 75265  qualified for automotive applications  power-on reset generator  automatic reset generation after voltage drop  precision voltage sensor  temperature-compensated voltage reference  programmable delay time by external capacitor  supply voltage range ...2 v to 6 v  defined reset output from v dd 1 v  power-down control support for static ram with battery backup  maximum supply current of 16 a  power saving totem-pole outputs description the tlc77xx family of micropower supply voltage supervisors provide reset control, primarily in microcomputer and microprocessor systems. during power-on, reset is asserted when v dd reaches 1 v. after minimum v dd ( 2 v) is established, the circuit monitors sense voltage and keeps the reset outputs active as long as sense voltage (v i(sense) ) remains below the threshold voltage. an internal timer delays return of the output to the inactive state to ensure proper system reset. the delay time, t d , is determined by an external capacitor: t d = 2.1 10 4 c t where c t is in farads t d is in seconds except for the tlc7701, which can be customized with two external resistors, each supervisor has a fixed sense threshold voltage set by an internal voltage divider. when sense voltage drops below the threshold voltage, the outputs become active and stay in that state until sense voltage returns above threshold voltage and the delay time, t d , has expired. in addition to the power-on-reset and undervoltage-supervisor function, the tlc77xx adds power-down control support for static ram. when control is tied to gnd, reset will act as active high. the voltage monitor contains additional logic intended for control of static memories with battery backup during power failure. by driving the chip select (cs ) of the memory circuit with the reset output of the tlc77xx and with the control driven by the memory bank select signal (csh1 ) of the microprocessor (see figure 10), the memory circuit is automatically disabled during a power loss. (in this application the tlc77xx power has to be supplied by the battery.) copyright ? 2008, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 8 7 6 5 control resin ct gnd v dd sense reset reset pw package (top view)
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 2 post office box 655303 ? dallas, texas 75265 ordering information ?  t a package orderable part number top-side marking tssop ? pw tape and reel tlc7701qpwrq1 7701q1 ?40 c to 125 c tssop ? pw tape and reel tlc7705qpwrq1 7705q1 tssop ? pw tape and reel tlc7733qpwrq1 7733q1 ? for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at http://www.ti.com. ? package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. the pw package is only available left-end taped and reeled (indicated by the r suffix on the device type; e.g., tlc7701qpwrep). function table control resin v i(sense) >v it+ reset reset l l false h l l l true h l l h false h l l h true l h h l false h l h l true h l h h false h l h h true h h reset and reset states shown are valid for t > t d . logic symbol ? ? this symbol is in accordance with ansi/ieee std 91?1984 and iec publication 617-12. 6 1 3 2 7 sense 1 1 1 reset 5 comp s v it s tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 3 post office box 655303 ? dallas, texas 75265 functional block diagram 1.1 v r2 ? r1 ? reset ? reset ? v dd gnd 8 6 5 4 resin control sense ct 3 1 2 7 1 m 50 a ? outputs are totem-pole configuration. external pullup or pulldown resistors are not required. ? nominal values: tlc7701 r1 (typ) r2 (typ) tlc7733 750 k 450 k ? 0 tlc7705 910 k 290 k ?
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 4 post office box 655303 ? dallas, texas 75265 timing diagram reset output output undefined v dd and v i(sense) t d threshold voltages v res v it? v it+ ?? supply voltage, v dd (see note 1) 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, control, resin , sense (see note 1) ?0.3 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . maximum low output current, i ol 10 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . maximum high output current, i oh ?10 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input clamp current, i ik (v i < 0 or v i > v dd ) 10 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output clamp current, i ok (v o < 0 or v o > v dd ) 10 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous total power dissipation see dissipation rating table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating free-air temperature range, t a : tl77xxq ?40 c to 125 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. note 1: all voltage values are with respect to gnd. dissipation rating table package t a 25 c power rating derating factor above t a = 25 c t a = 85 c power rating t a = 125 c power rating pw 525 mw 4.2 mw/ c 273 mw 105 mw recommended operating conditions at specified temperature range min max unit supply voltage, v dd 2 6 v input voltage, v i 0 v dd v high-level input voltage at resin and control ? , v ih 0.7 v dd v low-level input voltage at resin and control ? , v il 0.2 v dd v high-level output current, i oh v 27v ?2 ma low-level output current, i ol v dd 2.7 v 2 ma input transition rise and fall rate at resin and control, t/ v 100 ns/v operating free-air temperature range, t a ?40 125 c ? to ensure a low supply current, v il should be kept < 0.3 v and v ih > v dd ? 0.3 v.
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 5 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating conditions (see note 2) (unless otherwise noted) parameter test conditions tlc77xx unit parameter test conditions min typ ? max unit v dd = 2 v 1.8 v high level output voltage i oh = ? 20 a v dd = 2.7 v 2.5 v v oh high-level output voltage i oh 20 a v dd = 4.5 v 4.3 v i oh = ? 2 ma v dd = 4.5 v 3.7 v dd = 2 v 0.2 v low level output voltage i ol = 20 a v dd = 2.7 v 0.2 v v ol low-level output voltage i ol 20 a v dd = 4.5 v 0.2 v i ol = 2 ma v dd = 4.5 v 0.5 nti iitthhldlt tlc7701 1.04 1.1 1.16 v it ? negative-going input threshold voltage, sense (see note 3) tlc7705 v dd = 2 v to 6 v 4.43 4.5 4.63 v v it ? sense ( see n o t e 3) tlc7733 v dd 2 v to 6 v 2.855 2.93 3.03 v tlc7701 30 v h y s hysteresis voltage, sense tlc7705 v dd = 2 v to 6 v 70 mv v hys hysteresis voltage, sense tlc7733 v dd 2 v to 6 v 70 mv v res power-up reset voltage ? i ol = 20 a 1 v resin v i = 0 v to v dd 2 i input current control v i = v dd 7 15 a i i input current sense v i = 5 v 5 10 a sense, tlc7701 only v i = 5 v 2 resin = v dd , i dd supply current resin = v dd , sense = v dd v it max + 0.2 v 916 a i dd supply current control = 0 v, outputs open 9 16 a i dd(d) supply current during t d v dd = 5 v, resin = v dd , control = 0 v, v ct = 0 , sense = v dd , outputs open 120 150 a c i input capacitance, sense v i = 0 v to v dd 50 pf ? typical values apply at t a = 25 c. ? the lowest supply voltage at which reset becomes active. the symbol v res is not currently listed within eia or jedec standards for semiconductor symbology. rise time of v dd 15 s/v. notes: 2. all characteristics are measured with c t = 0.1 f. 3. to ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 f) should be connected near the supply terminals.
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 6 post office box 655303 ? dallas, texas 75265 switching characteristics at v dd = 5 v, r l = 2 k , c l = 50 pf, t a = full range (unless otherwise noted) measured tlc77xx parameter from (input) to (output) test conditions min typ max unit t d delay time v i(sense) v it+ reset and reset resin = 0.7 v dd , control = 0.2 v dd , c t = 100 nf, t a = full range, see timing diagram 1.1 2.1 4.2 ms t plh propagation delay time, low-to-high-level output reset v v max 0 2 v 20 t phl propagation delay time, high-to-low-level output sense reset v ih = v it+ max + 0.2 v, v il = v it? min ? 0.2 v, resin 07 v 5 s t plh propagation delay time, low-to-high-level output sense reset resin = 0.7 v dd , control = 0.2 v dd , ct nc ? 5 s t phl propagation delay time, high-to-low-level output reset ct = nc ? 20 t plh propagation delay time, low-to-high-level output reset v 07 v 20 s t phl propagation delay time, high-to-low-level output resin reset v ih = 0.7 v dd , v il = 0.2 v dd , sense v max+02v 60 ns t plh propagation delay time, low-to-high-level output resin reset sense = v it+ max + 0.2 v, control = 0.2 v dd , ct nc ? 65 ns t phl propagation delay time, high-to-low-level output reset ct = nc ? 20 s t plh propagation delay time, low-to-high-level output control reset v ih = 0.7 v dd , v il = 0.2 v dd , sense v max+02v 58 ns t phl propagation delay time, high-to-low-level output control reset sense = v it+ max + 0.2 v, resin = 0.7 v dd , ct = nc ? 58 ns low-level minimum pulse duration to switch reset sense v ih = v it+ max + 0.2 v, v il = v it? min ? 0.2 v, 3 s duration to switch reset and reset resin v il = 0.2 v dd , v ih = 0.7 v dd 1 s t r rise time reset and 10% to 90% 8 ns/v t f fall time and reset 90% to 10% 4 ns/v ? nc = no capacitor, and includes up to 100-pf probe and jig capacitance.
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 7 post office box 655303 ? dallas, texas 75265 parameter measurement information dut r l (see note a) c l (see note b) 5 v notes: a. for switching characteristics, r l = 2 k . b. c l = 50 pf includes jig and probe capacitance. figure 1. reset and reset output configurations v it? t w(l) t w(l) v it+ max + 200 mv 2.7 v v it+ v it? min ? 200 mv (a) resin (b) sense 0.4 v 1.5 v t w(l) 0.7 v dd 0.2 v dd 0.5 v dd m suffixed devices i, q, and y suffixed devices figure 2. input pulse definition waveforms
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 8 post office box 655303 ? dallas, texas 75265 typical characteristics figure 3 normalized input threshold voltage ? 1.005 ?40 1.004 1.003 1.002 1.001 1 0.999 0.998 0.997 ?20 0 20 40 60 80 100 120 t a ? temperature ? c v it? (t a )/v it? (25 c) normalized input threshold voltage vs temperature figure 4 10 ?0.5 9 8 7 6 5 4 3 2 0.5 1.5 2.5 3.5 4.5 5.5 6.5 v dd ? supply voltage ? v 1 0 ?1 resin = v dd = ?1 v to 6.5 v sense = gnd control = gnd ct = open = 100 pf t a = 25 c ? supply current ? a i dd supply current vs supply voltage figure 5 4.5 5 4 3.5 3 2.5 2 1.5 1 0.5 0 ?5 ?10 ?15 ?20 ?25 ?40 i oh ? high-level output current ? ma 0 ?0.5 ?1 v dd = 4.5 v resin = 4.5 v sense = 0.5 v control = 0 v ct = open = 100 pf ? high-level output voltage ? v v oh 5 125 c 85 c 25 c ?40 c ?55 c 0 c high-level output voltage vs high-level output current ?30 ?35 figure 6 ?5 6 5 4 3 2 0 5 10 15 20 25 30 i ol ? low-level output current ? ma 1 0 ?1 v dd = 4.5 v resin = 4.5 v sense = 5 v control = 0 v ct = open = 100 pf ? low-level output voltage ? v v ol ?40 c ?55 c 125 c 85 c 25 c 0 c low-level output voltage vs low-level output current
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 9 post office box 655303 ? dallas, texas 75265 typical characteristics figure 7 ?1 4 2 0 ?2 ?4 0 12345 6 v i ? input voltage at sense ? v ?6 ?8 ?10 ?55 c 125 c v dd = 4.5 v ct = open = 100 pf 8 6 ? input current ? a i i ?55 c 125 c input current vs input voltage at sense figure 8 0 7 6 5 4 3 50 100 150 200 sense threshold overdrive ? mv 2 1 0 ? minimum pulse duration at sense ? s t w minimum pulse duration at sense vs sense threshold overdrive 250 300 350 400 v dd = 2 v control = 0.4 v resin = 1.4 v ct = open = 100 pf
tlc7701-q1, tlc7705-q1, tlc7733-q1 micropower supply voltage supervisors sgls208a ? october 2003 ? revised may 2008 10 post office box 655303 ? dallas, texas 75265 application information tlc77xx gnd 0.1 f reset resin reset sense control ct gnd reset v dd tms70c20 nc 100 k reset v dd v dd 0.1 f figure 9. reset controller in a microcomputer system v dd gnd reset sense control ct reset gnd cs v dd tlc77xx reset csh1 add0 ?15 gnd r/w 16 8 a0 ?a15 d0 ?d7 data0 ?7 r/w 32k  8 cmos ram tms370 v dd resin 0.1 f 0.1 f 0.1 f figure 10. data retention during power down using static cmos rams
package option addendum www.ti.com 26-aug-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) device marking (4/5) samples TLC7701QPWRG4Q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7701q1 tlc7701qpwrq1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7701q1 tlc7705qpwrg4q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7705q1 tlc7733qpwrg4q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7733q1 tlc7733qpwrq1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7733q1 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 26-aug-2013 addendum-page 2 important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of tlc7701-q1, tlc7705-q1, tlc7733-q1 : ? catalog: tlc7701 , tlc7705 , tlc7733 ? enhanced product: tlc7701-ep , tlc7705-ep , tlc7733-ep ? military: tlc7705m , tlc7733m note: qualified version definitions: ? catalog - ti's standard catalog product ? enhanced product - supports defense, aerospace and medical applications ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TLC7701QPWRG4Q1 tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7701qpwrq1 tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7705qpwrg4q1 tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7733qpwrg4q1 tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7733qpwrq1 tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 package materials information www.ti.com 29-apr-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TLC7701QPWRG4Q1 tssop pw 8 2000 367.0 367.0 35.0 tlc7701qpwrq1 tssop pw 8 2000 367.0 367.0 35.0 tlc7705qpwrg4q1 tssop pw 8 2000 367.0 367.0 35.0 tlc7733qpwrg4q1 tssop pw 8 2000 367.0 367.0 35.0 tlc7733qpwrq1 tssop pw 8 2000 367.0 367.0 35.0 package materials information www.ti.com 29-apr-2016 pack materials-page 2
www.ti.com package outline c typ 6.6 6.2 1.2 max 6x 0.65 8x 0.30 0.19 2x 1.95 0.15 0.05 (0.15) typ 0 - 8 0.25 gage plane 0.75 0.50 a note 3 3.1 2.9 b note 4 4.5 4.3 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.25 mm per side. 5. reference jedec registration mo-153, variation aa. 1 8 0.1 c a b 5 4 pin 1 id area seating plane 0.1 c see detail a detail a typical scale 2.800
www.ti.com example board layout (5.8) 0.05 max all around 0.05 min all around 8x (1.5) 8x (0.45) 6x (0.65) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package symm symm land pattern example scale:10x 1 4 5 8 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. metal solder mask opening non solder mask defined solder mask details not to scale solder mask opening metal under solder mask solder mask defined
www.ti.com example stencil design (5.8) 6x (0.65) 8x (0.45) 8x (1.5) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. symm symm 1 4 5 8 solder paste example based on 0.125 mm thick stencil scale:10x
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? 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